A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as

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1. First, apply a thin film of a very tacky, no clean flux (Zephlux (NCF-0014 included in the Kit!) over the entire grid are a of the Ball Grid

Application Report SNOA021C– May 2004– Revised May 2004 AN-1126BGA (Ball Grid Array) ABSTRACT Leaders in the consumer electronics industry will be determined by

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eWLB is a further development of the classical Wafer Level Ball Grid Array Technology (WLB or WLP: wafer level package). The main driving force behind the eWLB